Redmi K40 game enhanced version of the mobile phone was officially released on April 27, one of the highlights of the Redmi K40 is the use of hexagonal boron nitride aerospace class cooling material, the hexagonal boron nitride paste on the back of the back cover, close to the motherboard part, can provide strong heat for the processor charging chip screen and other key areas.

Hexagonal boron nitride is a two-dimensional material with physical properties similar to graphene. This thermal conductive material belongs to the layered structure of hexagonal crystal system, which is similar to the structure of graphite and has high thermal conductivity. It is understood that boron nitride has a very good characteristic of insulation, so this time REDMI used it to heat the charging chip.

This material also has the characteristics of high temperature resistance. In the field of aerospace, it is also used in the nozzle of aircraft rocket engines. Because its structure is very similar to graphite, it has a hexagonal layered structure, so it is commonly known as white graphene.