Due to the strength of high hardness sapphire crystal big (9) mohs hardness processing enterprises to bring very great difficulty from the point of view of grinding material and academic circles, machining and grinding sapphire crystal boron carbide silicon dioxide is the best material for synthetic diamond due to the large synthetic diamond hardness (mohs hardness 10) in grinding sapphire going with scratches on the surface and affect the light transmittance of the chip, and high prices. However, the hardness of silicon dioxide is not enough (Mohs hardness 7). The grinding force is poor. Therefore, boron carbide abrasive (Mohs hardness 9.3) becomes the most ideal material for processing and grinding sapphire crystal.

Therefore, boron carbide abrasive (Moell hardness 9.3) has become the most ideal material for processing and grinding sapphire crystal. Boron carbide abrasive has excellent performance in the double-sided grinding of sapphire wafer and the thinning polishing of sapphire LED epitaxial wafer.